Lead-free solder paste product characteristics

1. Adapt to long-term printing (more than 6 hours).
2. High-intensity antioxidant capacity.
3. It has good viscosity and thixotropy, and it has extremely long viscosity time and is not easy to collapse.
4. Has a very high insulation resistance, no need to clean.
5. It is not easy to produce tiny solder balls after soldering.

V series no-clean lead-free solder paste is a solder paste that is developed according to IPC and JIS and other international standards to meet future environmental protection requirements. It adopts new rosin resin and composite anti-oxidation technology, and selects low-oxidation spherical solder alloy. It is made from powdery and chemically stable paste-like environmentally friendly flux.

Suitable for all kinds of precision welding in the electronic assembly process SMT production. Alloy series no-clean lead-free solder paste

Steel mesh

1. Directly adopt data file production, which reduces the production error link;
2. The position accuracy of the template opening is extremely high: the whole process error is ≤±4μm;
3. The opening of the template has a geometric shape, which is beneficial to the printing of solder paste.

Manual printing station

1. The combined printing platen has a fixed groove and PIN, which is convenient for installation and adjustment, and is suitable for printing on single and double panels.
2. The school board method uses steel mesh to move, and gives X, Y, Z of the printed (PCB). Correcting fine-tuning is quick and easy.
3. It can set one-way and two-way, multiple printing methods.
4. The blade angle is adjustable, steel scraper and rubber scraper are suitable.

Product parameters:

Printing table area 350×420mm
Frame size 370 × 470mm, 420 × 520mm, 550 × 650mm
Substrate size 250×330mm
Substrate thickness 0.2-2.0mm
Print position fixing PCB Outer Or Pin Positioning
Platen fine-tuning Front/back ±10mm R/L ±10mm
Printing accuracy ±0.05mm
Machine repeatability ±0.02mm
Minimum spacing 0.35mm
Machine size L500×W420×H200mm
Machine weight about 35kgs

Artificial patch production line

The artificial patch production line is mainly the patch mouth of the artificial simulation placement machine. The air pressure difference (reverse vacuum) generated by the artificial patch pen itself is used to directly suck the patch components from the material belt, and then manually The device is placed in the corresponding PADS position. Through the adjusted air pressure suction, the manual patch pen suction force is less than the sticking force of the solder paste (the patch glue), and the components are automatically placed on the corresponding PADS.

Top-grade large lead-free reflow

1. It adopts imported heating parts, uniform temperature and high thermal compensation efficiency, suitable for welding CSP and BGA components;
2. Special wind wheel design, large air exchange and stable wind speed;
Each temperature zone adopts forced independent circulation, independent PID control, and independent heating mode to make the furnace cavity temperature accurate, uniform, and large heat capacity:
3. Warm up quickly, from room temperature to working temperature ≦ 30 minutes;
The imported high-quality high-temperature high-speed motor has stable wind, low vibration and low noise;
4. The furnace body adopts double cylinder (electric push rod) jacking device, which is safe and reliable;
5. Chain and mesh belt synchronous speed regulation, using frequency conversion precision speed regulation;
6. Special high-quality aluminum alloy rail design, small deformation, automatic chain refueling device;
7. UPS power-off protection function ensures that the PCB board outputs normally after power-off, and is not damaged;
8. Powerful software function, monitor and measure the temperature of the PCB board online, and analyze, store and print the data curve at any time;
9. Industrial control PC and PLC communication adopt MODBUS protocol, work stably, prevent the phenomenon of crash;
10. Automatic monitoring, showing the working status of the equipment, can be corrected at any time;
11. Special patented furnace design, good thermal insulation, and the lowest power consumption in the same industry;
12. The patented guide rail is not deformed at high temperature, and the three-wire rod synchronously widens the structure, effectively ensuring that the guide rails are parallel, preventing the board from falling, the occurrence of the card board, no cleaning, and easy adjustment. The adjustment operation can be performed both automatically and manually.
13. Standard chain and net chain synchronous iso-speed parallel transportation, can process single-sided, double-sided PCB board, optional double-rail transportation system.
14. The automatic width adjustment system adopts closed-loop PID control, which can automatically adjust to the required width according to the parameters input by the computer, and the accuracy can reach 0.2mm.
15. Due to the modular design of each temperature zone, hot air motor and heating wire are easy to maintain and maintain.
16. Strong cooling air cooling, cold air exchange is fast, wind speed is uniform, slope can be controlled by frequency conversion, tin point is smooth and bright; (nitrogen machine optional)
17. Nitrogen flow meter can monitor nitrogen flow at any time; (optional for nitrogen filling machine)
18. Rapid oxygen and nitrogen to obtain high purity nitrogen; (optional for nitrogen filling machine)
19. Vertical anti-leakage technology to prevent nitrogen leakage; (optional for nitrogen filling machine)