>High assembly density, small size and light weight of electronic products. The size and weight of patch components are only about 1/10 of that of traditional plug-in components. After SMT is generally used, the volume of electronic products is reduced by 40%~60%, and the weight is reduced by 60%. ~80%. >High reliability and strong anti-vibration ability. The solder joint defect rate is low. >High frequency characteristics are good. Reduced electromagnetic and radio frequency interference. > Easy to automate and increase productivity. Reduce costs by 30% to 50%. > Save materials, energy, equipment, manpower, time, etc.